Honeywell International Inc.
Thermal imaging with an integrated photonics chip

Abstract:

An integrated photonics chip for thermal imaging comprises a photonics substrate including a plurality of receiver elements. Each receiver element comprises a first grating coupler optically coupled to a first waveguide filter and configured to receive a first wavelength of light at a given angle, with the first waveguide filter configured to pass the first wavelength of light; and a second grating coupler optically coupled to a second waveguide filter and configured to receive a second wavelength of light at the given angle, with second waveguide filter configured to pass the second wavelength of light. Each receiver element receives the wavelengths of light from an object of interest that emits the light due to blackbody radiation, and receives the wavelengths of light at respectively different angles. Each grating coupler receives a unique wavelength of light with respect to the other wavelengths of light received by the other grating couplers.