Honeywell International Inc.
MULTI-PATTERNED SPUTTER TRAPS AND METHODS OF MAKING

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Abstract:

A method of forming a particle trap on a sputtering chamber component comprises forming a first pattern on at least a portion of a surface of the sputtering chamber component to form a first patterned top surface, and forming a second pattern on at least a portion of the first patterned top surface.

Status:
Application
Type:

Utility

Filling date:

21 Oct 2021

Issue date:

10 Feb 2022