International Business Machines Corporation
VARIABLE THICKNESS LID ADHESIVE

Abstract:

Chip pairs in a semiconductor module have a spacing between them that forms a spacing region. A lid has a lid bottom side and one or more feet. The feet protrude from a periphery of the lid bottom side. A sealband adhesive has a sealband adhesive thickness and adheres the feet to a substrate so the chip pairs are under the lid bottom side and back sides of the chips are in thermal contact with the lid bottom side. A variable thickness lid adhesive connects the substrate in the spacing region to the lid bottom side. The variable thickness lid adhesive has a lid adhesive thickness that is greater than the sealband adhesive thickness by a delta thickness amount. In some embodiments, the lid also has a shortened central lid rib with a bottom. The shorten central lid rib protrudes an extension distance from the lid bottom side into the spacing region. In these embodiments, the variable thickness lid adhesive connects the substrate in the spacing region to the bottom. In some embodiments, the shortened central lid rib is notched.