International Business Machines Corporation
EFUSE STRUCTURE WITH MULTIPLE LINKS

Abstract:

An eFuse structure including a semiconductor substrate; back end of the line (BEOL) metallization levels on the semiconductor substrate; vias extending through the metallization levels; at least one of the metallization levels including one or more metallic plates in electrical contact with one of the vias, the one or more metallic plates having at least one fusible link in electrical contact with one or more additional vias. The eFuse structure may form a multi-fuse structure such that each fusible link may be fused separately or together at the same time.