International Business Machines Corporation
TOP VIAS WITH SUBTRACTIVE LINE FORMATION

Abstract:

Integrated chips and methods of forming the same include forming a conductive layer to a line height. A dielectric layer is formed over the conductive layer to a via height, with at least one opening that exposes a via region of the conductive layer. A conductive via is formed in the opening having the via height. The conductive layer is patterned to form a conductive line having the line height.