International Business Machines Corporation
High-density field-enhanced ReRAM integrated with vertical transistors

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Abstract:

A method is presented for integrating a resistive random access memory (ReRAM) device with vertical transistors on a single chip. The method includes forming a vertical field effect transistor (FET) including an epitaxial tip defining a drain terminal and forming the ReRAM device in direct contact with the epitaxial tip of the vertical FET such that a current conducting filament is formed at the epitaxial tip due to electric field enhancement.

Status:
Grant
Type:

Utility

Filling date:

27 Feb 2020

Issue date:

10 Aug 2021