International Business Machines Corporation
MAGNETORESISTIVE RANDOM-ACCESS MEMORY WITH METAL INTERCONNECTS
Last updated:
Abstract:
A method of fabricating an MRAM device, the method including forming a magnetoresistive random-access memory (MRAM) stack comprising a first hard mask, forming sidewall spacers adjacent to the MRAM stack, forming a layer of interconnect metal around and above the MRAM stack, recessing the interconnect metal, forming a layer of a second hard mask over the interconnect metal, and patterning and etching the second hard mask and interconnect metal, forming interconnect metal lines.
Status:
Application
Type:
Utility
Filling date:
21 Feb 2020
Issue date:
26 Aug 2021