International Business Machines Corporation
STT MRAM MATERIALS WITH HEAVY METAL INSERTION

Last updated:

Abstract:

A bottom pinned magnetic tunnel junction (MTJ) stack having improved switching performance is provided which can be used as a component/element of a spin-transfer torque magnetoresistive random access memory (STT MRAM) device. The improved switching performance which, in turn, can reduce write errors and improve write voltage distributions, is obtained by inserting at least one heavy metal-containing layer into the magnetic free layer and/or by forming a heavy metal-containing layer on a MTJ capping layer that is located above the magnetic free layer.

Status:
Application
Type:

Utility

Filling date:

14 Feb 2020

Issue date:

19 Aug 2021