International Business Machines Corporation
CREATION OF STRESS IN THE CHANNEL OF A NANOSHEET TRANSISTOR

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Abstract:

Provided are embodiments for a semiconductor device. The semiconductor device includes a nanosheet stack comprising one or more layers, wherein the one or more layers are induced with strain from a modified sacrificial gate. The semiconductor device also includes one or more merged S/D regions formed on exposed portions of the nanosheet stack, wherein the one or more merged S/D regions fix the strain of the one or more layers, and a conductive gate formed over the nanosheet stack, wherein the conductive gate replaces a modified sacrificial gate without impacting the strain induced in the one or more layers. Also provided are embodiments for a method for creating stress in the channel of a nanosheet transistor.

Status:
Application
Type:

Utility

Filling date:

26 Apr 2021

Issue date:

19 Aug 2021