International Business Machines Corporation
HYBRID INTERCONNECT WITH A RELIABILITY LINER IN WIDE FEATURES

Abstract:

A back-end-of-the-line (BEOL) interconnect structure is provided that includes a hybrid metal-containing electrically conductive structure and a copper-containing electrically conductive structure embedded in an interconnect dielectric material layer. The hybrid metal-containing electrically conductive structure has a first critical dimension and includes an optional diffusion barrier liner and a hybrid metal-containing region. The copper-containing electrically conductive structure has a second critical dimension that is greater than the first critical dimension and includes an optional first diffusion barrier liner, a hybrid metal-containing liner, a second diffusion barrier liner and a copper-containing region. The hybrid metal-containing region and the hybrid metal-containing liner are compositionally the same and include a metal or metal alloy that has a higher bulk resistivity than copper.