International Business Machines Corporation
HIGH BANDWIDTH MULTICHIP MODULE

Abstract:

Multi-semiconductor chip modules that have a substrate with a substrate surface, one or more first substrate connections, and one or more second substrate connections. One or more first semiconductor chips (chips) has one or more larger first chip connections and one or more smaller first chip connections on a first chip bottom surface. One or more of the larger first chip connections physically and electrically connected to a respective first substrate connection. One or more second chips has one or more larger second chip connections and one or more smaller second chip connections on a second chip bottom surface. One or more of the larger second chip connections physically and electrically connected to a respective second substrate connection. A bridge has a bridge thickness, a bridge surface, and one or more bridge connections on the bridge surface. A first part of the bridge surface is under the first chip bottom surface and a second part of the bridge surface is under the second chip bottom surface. The bridge is disposed on the substrate between the first semiconductor chip and the second semiconductor chip, and one or more of the smaller first chip connections is physically and electrically connected to a respective first bridge connection on the first part of the bridge surface and one or more of the smaller second chip connection is physically and electrically connected to a respective second bridge connection. Some embodiments, a large surface bridge with the bridge. The large surface bridge and bridge can have different configurations. The bridge thickness allows larger chip connections and smaller connections with high pitch to intermingled in a location within the module. Methods of manufacture are disclosed.