International Business Machines Corporation
SELF-ALIGNED BLOCK VIA PATTERNING FOR DUAL DAMASCENE DOUBLE PATTERNED METAL LINES

Abstract:

Embodiments of the present invention disclose a method and apparatus for making a multi-layer device comprising a conductive layer, a dielectric layer formed on top of conductive layer, a via pattern formed in the dielectric layer, wherein the via pattern is comprised of a plurality of channels and columns, wherein a first portion of the via pattern downwards extends through the entire dielectric layer to directly contact the conductive layer, wherein a second portion of the via pattern extends downwards without coming into direct contact with the conductive layer.