International Business Machines Corporation
MTJ containing device encapsulation to prevent shorting

Abstract:

A magnetic tunnel junction (MTJ) containing device is provided in which a conformal dielectric encapsulation liner is located on a sidewall of each of a MTJ pillar and an overlying top electrode, and a non-conformal dielectric encapsulation liner is located on the conformal dielectric encapsulation liner. This dual encapsulation liner structure prevents the bottom electrode of the MTJ containing device from being physically exposed thus eliminating the possibility that the bottom electrode can be a source of resputtered conductive metal particles that can deposit on a sidewall of the MTJ pillar. As such, electrical shorting is reduced in the MTJ containing device of the present application. Also, the dual encapsulation liner structure can mitigate chemical diffusion into the tunnel barrier material of the MTJ pillar.