International Business Machines Corporation
Gate-all-around transistor structure
Last updated:
Abstract:
A semiconductor device and method of forming the same including a plurality of vertically aligned semiconductor channel layers disposed above a substrate layer, a gate stack formed on, and around the vertically aligned semiconductor channel layers and source and drain elements disposed in contact with sidewalls of the vertically aligned semiconductor channel layers. An uppermost vertically aligned semiconductor channel layer has a first thickness of semiconductor material and the remaining vertically aligned semiconductor channel layers have a second thickness of semiconductor material different from the first thickness.
Status:
Grant
Type:
Utility
Filling date:
14 Nov 2019
Issue date:
14 Sep 2021