International Business Machines Corporation
Chip interconnect devices

Abstract:

An interconnect device may include a first center conductor of a first material that has a first durometer. The first center conductor may be surrounded by a first inner dielectric ring, which may be surrounded by a conductive region of a second material having a second durometer. The second durometer may be different from the first durometer. The conductive region may have a first end that defines a first plane and a second end that defines a second plane. An outer dielectric ring may surround the conductive region. The first center conductor may have a first bulb and a second bulb, the first bulb may extend in a direction away from the second plane and beyond the first plane, and the second bulb may extend in a direction away from the first plane and beyond the second plane.