International Business Machines Corporation
INVERTED, SELF-ALIGNED TOP-VIA STRUCTURES

Abstract:

A multilayered integrated circuit includes a first layer with a first conductive element overlaying a substrate, a second layer with a second conductive element overlaying the first layer, an intermediate layer between the first layer and the second layer, and a via structure. The via structure is partially embedded within the intermediate layer and is communicatively coupled to the first conductive element and the second conductive element. The via structure extends from the first conductive element and has a first end with a first end width and a second end with a second end width. The second end is further from the substrate than the first end and the first end width is greater than the second end width such that the via structure tapers between the first end and the second end of the via structure.