International Business Machines Corporation
DUMMY FIN TEMPLATE TO FORM A SELF-ALIGNED METAL CONTACT FOR OUTPUT OF VERTICAL TRANSPORT FIELD EFFECT TRANSISTOR

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Abstract:

A technique relates to a semiconductor device. A source/drain layer is formed. Fins with gate stacks are formed in a fill material, a dummy fin template including at least one fin of the fins and at least one gate stack of the gate stacks, the fins being formed on the source/drain layer. A trench is formed through the fill material by removing the dummy fin template, such that a portion of the source/drain layer is exposed in the trench. A source/drain metal contact is formed on the portion of the source/drain layer in the trench.

Status:
Application
Type:

Utility

Filling date:

30 Jun 2021

Issue date:

21 Oct 2021