International Business Machines Corporation
NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT

Abstract:

Provided is a compound that can be used as a base resin for a photosensitive resin composition. The photosensitive resin can form a fine pattern and can achieve high resolution without impairing mechanical strength and solubility. The compound is represented by the general formula (1): ##STR00001## wherein Z represents a linear, branched or cyclic divalent hydrocarbon group having 2 to 30 carbon atoms; X.sup.1 to X.sup.3 represent any of --CO.sub.2--, --CONR.sup.X1--, --O--, --NR.sup.X1--, --S--, --SO.sub.2--, --SO.sub.3-- and --SO.sub.2NR.sup.X1-- and may be the same as or different from each other, provided that R.sup.X1 is a hydrogen atom or a monovalent hydrocarbon group having 1 to 30 carbon atoms; Ar represents a divalent aromatic group having 2 to 30 carbon atoms; L.sup.1 and L.sup.2 independently represent a divalent hydrocarbon group having 1 to 30 carbon atoms; and x and y are each independently 0 or 1.