International Business Machines Corporation
Differing device characteristics on a single wafer by selective etch

Last updated:

Abstract:

Semiconductor devices include a substrate layer and a semiconductor layer formed over the substrate layer. A dielectric layer fills a gap between the semiconductor layer and the substrate layer, on end faces of the semiconductor layer, and on a top surface of the semiconductor layer.

Status:
Grant
Type:

Utility

Filling date:

31 Mar 2020

Issue date:

23 Nov 2021