International Business Machines Corporation
Differing device characteristics on a single wafer by selective etch
Last updated:
Abstract:
Semiconductor devices include a substrate layer and a semiconductor layer formed over the substrate layer. A dielectric layer fills a gap between the semiconductor layer and the substrate layer, on end faces of the semiconductor layer, and on a top surface of the semiconductor layer.
Status:
Grant
Type:
Utility
Filling date:
31 Mar 2020
Issue date:
23 Nov 2021