International Business Machines Corporation
VIA INTERCONNECTS FOR A MAGNETORESISTIVE RANDOM-ACCESS MEMORY DEVICE

Abstract:

A via interconnect structure for an MRAM device is provided. The via interconnect structure includes an interlayer dielectric layer having a via formed therein, a magnetic metal layer formed in the via, the magnetic metal layer having a cavity formed therein, and a nonmagnetic metal layer formed in the cavity of the magnetic metal layer. The magnetic metal layer is configured such that magnetization vectors of the magnetic metal layer are least substantially in-plane relative to an MRAM stack structure of the MRAM device.