International Business Machines Corporation
CONTACTS AND LINERS HAVING MULTI-SEGMENTED PROTECTIVE CAPS

Abstract:

Embodiments of the invention include a method of forming a multi-layer integrated circuit (IC) structure that includes forming a first layer of the multi-layered IC structure, wherein the first layer includes a trench having a liner and a conductive interconnect formed in the trench. The liner is formed such that it is not on a portion of a sidewall of the conductive interconnect. A multi-segmented cap is formed having a first cap segment and a second cap segment. The first cap segment is on a top surface of the conductive interconnect, and a first portion of the second cap segment is on the portion of the sidewall of the conductive interconnect. The second cap segment is on a top surface of the first cap segment.