International Business Machines Corporation
Transistor having reduced contact resistance

Last updated:

Abstract:

An integrated semiconductor device having a substrate, a bottom source or drain (S/D) structure formed on the substrate. In addition, the device includes a fin extending from the bottom S/D structure and a gate formed around the fin. A top S/D structure is formed on top of the fin. The top S/D structure includes a recessed top S/D surface and a silicide layer covering a top portion of the recess. A contact is communicatively coupled to a surface of the silicide layer of the recessed top S/D surface of the top S/D structure.

Status:
Grant
Type:

Utility

Filling date:

2 May 2019

Issue date:

30 Nov 2021