International Business Machines Corporation
Reduced-stress tape head module

Abstract:

An apparatus, according to one embodiment, includes at least one reading die coupled to a pedestal of an associated read beam, each reading die having an array of read transducers extending parallel to a longitudinal axis of the reading die. At least one writing die is coupled to a pedestal of an associated write beam, each writing die having an array of write transducers extending parallel to a longitudinal axis of the writing die. The read and write beams are coupled together thereby forming a head. At least one region of at least one of the dice is cantilevered over the associated beam. Widths of the reading and writing dice measured in a direction of tape travel thereover are substantially the same. Widths of the pedestals of the read and write beams measured in the direction of tape travel thereover are substantially the same.