International Business Machines Corporation
High resolution brain-electronics interface

Last updated:

Abstract:

Aspects include high resolution brain-electronic interfaces and related methods. Aspects include forming a semiconductor circuit on a substrate, depositing a tensile stress layer on the circuit, and separating the semiconductor circuit from a portion of the silicon substrate. Aspects also include removing the tensile stress layer from the semiconductor circuit and transferring the semiconductor circuit to a biocompatible film.

Status:
Grant
Type:

Utility

Filling date:

16 Aug 2019

Issue date:

7 Dec 2021