International Business Machines Corporation
METAL SURFACE PROTECTION

Abstract:

Techniques regarding methods and/or apparatuses for protecting metal substrates during one or more lithography processes are provided. For example, one or more embodiments described herein can comprise a method that can include coating a metal substrate with a polymer film that self-assembles on a metal oxide positioned on a surface of the metal substrate. The method can also include covalently bonding the polymer film to the metal oxide.