International Business Machines Corporation
Device for high dimensional computing comprising an associative memory module

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Abstract:

The invention is notably directed at a device for high-dimensional computing comprising an associative memory module. The associative memory module comprises one or more planar crossbar arrays. The one or more planar crossbar arrays comprise a plurality of resistive memory elements. The device is configured to program profile vector elements of profile hypervectors as conductance states of the resistive memory elements and to apply query vector elements of query hypervectors as read voltages to the one or more crossbar arrays. The device is further configured to perform a distance computation between the profile hypervectors and the query hypervectors by measuring output current signals of the one or more crossbar arrays. The invention further concerns a related method and a related computer program product.

Status:
Grant
Type:

Utility

Filling date:

30 May 2019

Issue date:

18 Jan 2022