International Business Machines Corporation
Battery-free and substrate-free IoT and AI system package

Abstract:

A tetherless system-in-package includes a first integrated circuit (IC) chip having interconnects and energy harvesting elements. A super-capacitor is configured to store a charge output by the energy harvesting elements. At least a second IC chipset including a smart chip and an optical I/O or an RF I/O is aligned and bonded to at least one of the interconnects of the first IC chip. The first IC chip and the second IC chip are configured to receive a portion of the charge stored by the super-capacitor.