International Business Machines Corporation
ELECTROMAGNETIC SHIELDING OF HEATSINKS WITH SPRING PRESS-FIT PINS

Last updated:

Abstract:

An apparatus for grounding a heatsink utilizing an EMC spring press-fit pin includes a printed circuit board, a logic chip, a heatsink, and a grounding member, where the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member. The logic chip is electrically coupled to the printed circuit board and the heatsink is disposed on a top surface of the logic chip. The first terminal pin at the first end of the grounding member is disposed in a plated-through hole of the printed circuit, where the grounding member is configured to electrically couple the heatsink to the printed circuit board.

Status:
Application
Type:

Utility

Filling date:

27 Jul 2020

Issue date:

27 Jan 2022