International Business Machines Corporation
Maskless top source/drain epitaxial growth on vertical transport field effect transistor

Last updated:

Abstract:

A method for fabricating a vertical transistor device includes forming a first plurality of fins in a first device region and a second plurality of fins in a second device region on a substrate. The first plurality of fins have a SiGe portion exposed above a top surface of the first region and a portion of the second plurality of fins are exposed above a top surface of the second region. The method further includes depositing a first GeO.sub.2 layer on the top surface of the device and over the exposed SiGe portion of the first plurality of fins and the exposed portion of the second plurality of fins.

Status:
Grant
Type:

Utility

Filling date:

3 Apr 2020

Issue date:

8 Feb 2022