International Business Machines Corporation
WARP MITIGATION USING PATTERN-MATCHED METAL LAYERS IN ORGANIC SUBSTRATES

Abstract:

Embodiments of the present invention include an organic substrate that has one or more layers. Each of the layers is made of one or more sub-patterns of conductive material disposed on a non-conductive material. The layers are divided into one or more tile subareas. A corresponding layer pair has a corresponding upper layer (with corresponding upper tile subareas) and a corresponding lower layer (with corresponding lower tile subareas) that are equidistant from and symmetric about a reference plane. Each corresponding upper tile subarea and the corresponding lower tile subarea are in a same vertical projection. Once processed by methods disclosed, a symmetric upper (lower) layout on the corresponding upper (lower) tile subarea replaces an original corresponding upper (lower) layer. The symmetric upper and lower layouts have one or more upper portions that have no electrical function. While the upper portions and lower portions have no electrical function, they are partly responsible for making the symmetric lower layout and symmetric upper layout more thermo-mechanically symmetric and help reducing warp in the organic substrate. Alternative methods of making organic substrates with reduced warp are disclosed. The methods are compatible with existing manufacturing processes.