International Business Machines Corporation
Customized module lid
Last updated:
Abstract:
A method of forming a custom module lid. The method may include placing a multichip module (MCM) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components.
Status:
Grant
Type:
Utility
Filling date:
30 Nov 2018
Issue date:
8 Mar 2022