International Business Machines Corporation
Customized module lid

Last updated:

Abstract:

A method of forming a custom module lid. The method may include placing a multichip module (MCM) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components.

Status:
Grant
Type:

Utility

Filling date:

30 Nov 2018

Issue date:

8 Mar 2022