International Business Machines Corporation
Stacked device structure

Abstract:

A method for fabricating a stacked device structure includes preparing plural device layers each having a glass layer, a metal layer, and a resin layer. The metal layer corresponds to one of plural metal layers. The method further includes stacking the plural device layers to compose stacked device layers; and drilling vertically a hole into the stacked device layers by laser such that the plural metal layers are exposed to the hole and filling conductive material into the hole to connect the plural metal layers.