International Business Machines Corporation
THERMALLY REWORKABLE ADHESIVES FOR ELECTRONIC DEVICES

Abstract:

A thermally reworkable adhesive includes at least one di-epoxide, at least one diamine that is reactive with the at least one di-epoxide, at least one additive that is miscible, but not reactive, with the at least one di-epoxide and/or the at least one diamine. Reaction of the at least one di-epoxide and the at least one diamine forms a crosslinked polymer network and the at least one additive offsets the stoichiometry of the crosslinked polymer network by 5-50%. The offset crosslinked polymer network forms the thermally reworkable adhesive that once cured, at a temperature in the range of 20-200.degree. C., can be de-bonded from a device to which it is attached at a temperature in the range of 50-200.degree. C.