International Business Machines Corporation
CONFINED GALLIUM NITRIDE EPITAXIAL LAYERS

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Abstract:

A method of manufacturing an electronic device is provided. The method includes forming a dielectric layer on a Si-based substrate, etching away portions of the dielectric layer to form a crisscrossing grid pattern of remaining portions of the dielectric layer and to expose the substrate in areas where the dielectric layer is removed, forming GaN-based layers on the substrate in growth areas between sidewalls of the remaining portions of the dielectric layer, and forming a semiconductor device on the GaN-based layers.

Status:
Application
Type:

Utility

Filling date:

5 Nov 2020

Issue date:

5 May 2022