International Business Machines Corporation
Vertical field effect transistors with self aligned contacts

Abstract:

A method of forming a semiconductor device is provided that includes forming a first source/drain region in a supporting substrate abutting a fin structure; and forming an isolation region in the supporting substrate adjacent to a first side of the fin structure, wherein the first source/drain region is positioned on an opposing second side of the fin structure. A gate structure is formed on the channel region portion of the fin structure. In a following step, a second source/drain region on an upper surface of the fin structure. Contacts can be formed aligned to the first source/drain region and the gate structure.