International Business Machines Corporation
Reducing parasitic bottom electrode resistance of embedded MRAM
Last updated:
Abstract:
An embedded magnetoresistive random-access memory (MRAM) device including a portion of a metal wiring layer above a semiconductor device and a bottom electrode over the portion of the metal wiring layer. The embedded MRAM where the bottom electrode connects to a first portion of a bottom surface of a magnetoresistive random access memory pillar and a sidewall spacer is on the magnetoresistive random access memory pillar. The embedded MRAM device includes a ring of inner metal is on the portion of the metal wiring layer surrounding a portion of the bottom electrode.
Status:
Grant
Type:
Utility
Filling date:
5 Mar 2020
Issue date:
28 Jun 2022