International Business Machines Corporation
Creating different width lines and spaces in a metal layer

Last updated:

Abstract:

An approach provides a semiconductor structure with a semiconductor layer that has a plurality of metal lines on the semiconductor layer where a first line of the plurality of metal lines on the semiconductor layer has a different line width than a second line of the plurality of metal lines on the semiconductor layer and a low-k dielectric material covers the plurality of metal lines and the semiconductor layer between the plurality of metal lines.

Status:
Grant
Type:

Utility

Filling date:

22 Sep 2020

Issue date:

28 Jun 2022