International Business Machines Corporation
Creating different width lines and spaces in a metal layer
Last updated:
Abstract:
An approach provides a semiconductor structure with a semiconductor layer that has a plurality of metal lines on the semiconductor layer where a first line of the plurality of metal lines on the semiconductor layer has a different line width than a second line of the plurality of metal lines on the semiconductor layer and a low-k dielectric material covers the plurality of metal lines and the semiconductor layer between the plurality of metal lines.
Status:
Grant
Type:
Utility
Filling date:
22 Sep 2020
Issue date:
28 Jun 2022