International Business Machines Corporation
WRAPAROUND CONTACT TO A BURIED POWER RAIL

Abstract:

An approach to form a semiconductor structure with a buried power rail. The semiconductor structure includes a buried power rail in a semiconductor substrate where a buried contact contacts to a first portion of a top surface of the buried power rail to a source/drain of a semiconductor device. Additionally, the semiconductor structure includes a first portion of a top surface of the buried contact that is below a top surface of the source/drain of the semiconductor device and a portion of a bottom surface of the buried contact that is in a cavity formed in the source/drain of the semiconductor device.