International Business Machines Corporation
DISTRIBUTING HEATSINK LOAD ACROSS A PROCESSOR MODULE WITH SEPARABLE INPUT/OUTPUT (I/O) CONNECTORS
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Abstract:
A heatsink for distributing heatsink load across a processor module with separable input/output (I/O) connectors, comprising: a thermal conductor; and one or more pistons aligned with one or more separable interconnects of the processor module.
Status:
Application
Type:
Utility
Filling date:
25 Jan 2021
Issue date:
28 Jul 2022