International Business Machines Corporation
Lid/heat spreader having targeted flexibility
Last updated:
Abstract:
An electronic apparatus that includes a semiconductor device; an electronic packaging substrate for receiving the semiconductor device; a thermal interface material on the semiconductor device; and a lid in contact with the thermal interface material and having a zone of targeted flexibility spaced from the semiconductor device.
Status:
Grant
Type:
Utility
Filling date:
27 Jan 2020
Issue date:
30 Aug 2022