International Business Machines Corporation
Lid/heat spreader having targeted flexibility

Last updated:

Abstract:

An electronic apparatus that includes a semiconductor device; an electronic packaging substrate for receiving the semiconductor device; a thermal interface material on the semiconductor device; and a lid in contact with the thermal interface material and having a zone of targeted flexibility spaced from the semiconductor device.

Status:
Grant
Type:

Utility

Filling date:

27 Jan 2020

Issue date:

30 Aug 2022