International Business Machines Corporation
Techniques for forming replacement metal gate for VFET

Abstract:

RMG techniques for VFET formation using a chamfering process are provided. In one aspect, a method of forming a VFET device includes: patterning fins adjacent to one another in a substrate; forming bottom source/drains at a base of the fins; forming bottom spacers over the bottom source/drains; forming sacrificial gates alongside the fins; forming top source/drains at a top of the fins; forming top spacers surrounding the top source/drains; removing the sacrificial gates; depositing a high-.kappa. gate dielectric along sidewalls of the fins; removing the high-.kappa. gate dielectric from an opening between adjacent top spacers; depositing at least a first workfunction-setting metal layer onto the high-.kappa. gate dielectric; removing the first workfunction-setting metal layer from the opening between the adjacent top spacers; and depositing at least a second workfunction-setting metal layer onto the first workfunction-setting metal layer to form replacement metal gates. A VFET device is also provided.