International Business Machines Corporation
SINTERING A NANOPARTICLE PASTE FOR SEMICONDUCTOR CHIP JOIN

Abstract:

An approach to provide a method of joining a semiconductor chip to a semiconductor substrate, the approach includes depositing a nanoparticle paste and aligning each of one or more solder contacts on a semiconductor chip to a substrate bond pad. The approach includes sintering, in a reducing gaseous environment, the nanoparticle paste to connect the semiconductor chip to a semiconductor substrate bond pad.