International Business Machines Corporation
Localized rework using liquid media soldering

Abstract:

Provided is a system for removing an electronic component from a printed circuit board (PCB). The system may comprise a heating well configured to hold a rework liquid. The system may further comprise a head system configured to create a liquid-tight seal around an electronic component. The system may further comprise a nozzle and a mechanical capture device disposed within the head system. The mechanical capture device may be configured to attach to the electronic component. The system may further comprise a controller. The controller may be configured to release the rework liquid through the nozzle and onto the electronic component and lift the electronic component off the PCB.