International Business Machines Corporation
On-chip decoupling capacitor
Last updated:
Abstract:
A semiconductor device including a decoupling capacitor disposed between adjacent device source-drain regions, the decoupling capacitor comprising an outer metal liner, a dielectric disposed adjacent to the outer metal liner, and an inner metal liner disposed adjacent to the dielectric, a single diffusion break isolation region disposed between the adjacent device source-drain regions. The outer metal liner is disposed in electrical contact with the adjacent device source-drain regions.
Status:
Grant
Type:
Utility
Filling date:
12 Mar 2020
Issue date:
20 Sep 2022