International Business Machines Corporation
ELECTRONIC APPARATUS HAVING INTER-CHIP STIFFENER
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Abstract:
An electronic apparatus that includes a first semiconductor chip mounted on a substrate; a second semiconductor chip mounted on the substrate; a spacer attached to the substrate and situated between the first and second semiconductor chips; a lid mounted on the substrate and enclosing the first and second semiconductor chips and the spacer, the spacer having an adhesive material adhesively attached to the lid; and underfill material underneath the first and second semiconductor chips, underneath the spacer and between the spacer and the first and second semiconductor chips.
Status:
Application
Type:
Utility
Filling date:
16 Jan 2020
Issue date:
22 Jul 2021