International Business Machines Corporation
MEMORY DEVICE HAVING A RING HEATER

Last updated:

Abstract:

A semiconductor device includes a base structure of a memory device including a first electrode, first dielectric material having a non-uniform etch rate disposed on the base structure, a via within the first dielectric material, and a ring heater within the via on the first electrode. The ring heater has a geometry based on a shape of the via that produces a resistance gradient.

Status:
Application
Type:

Utility

Filling date:

6 Jan 2020

Issue date:

8 Jul 2021