International Business Machines Corporation
MEMORY DEVICE HAVING A RING HEATER
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Abstract:
A semiconductor device includes a base structure of a memory device including a first electrode, first dielectric material having a non-uniform etch rate disposed on the base structure, a via within the first dielectric material, and a ring heater within the via on the first electrode. The ring heater has a geometry based on a shape of the via that produces a resistance gradient.
Status:
Application
Type:
Utility
Filling date:
6 Jan 2020
Issue date:
8 Jul 2021