International Business Machines Corporation
Method of implementing stub-less PCB vias

Last updated:

Abstract:

A method and structure are provided for implementing stub-less printed circuit board (PCB) vias and custom interconnect through laser-excitation conductive track structures. Stub-less printed PCB vias are formed which terminate at desired signal layers by controlled laser excitation without stubs or the need to back-drill to remove such stubs.

Status:
Grant
Type:

Utility

Filling date:

24 Apr 2019

Issue date:

13 Jul 2021