International Business Machines Corporation
Method of implementing stub-less PCB vias
Last updated:
Abstract:
A method and structure are provided for implementing stub-less printed circuit board (PCB) vias and custom interconnect through laser-excitation conductive track structures. Stub-less printed PCB vias are formed which terminate at desired signal layers by controlled laser excitation without stubs or the need to back-drill to remove such stubs.
Status:
Grant
Type:
Utility
Filling date:
24 Apr 2019
Issue date:
13 Jul 2021