International Business Machines Corporation
Self-aligned gate contact integration with metal resistor

Abstract:

A middle-of-line (MOL) structure is provided and includes device and resistive memory (RM) regions. The device region includes trench silicide (TS) metallization, a first interlayer dielectric (ILD) portion and a first dielectric cap portion disposed over the TS metallization and the first ILD portion. The RM region includes a second dielectric cap portion, a second ILD portion and an RM resistor interposed between the second dielectric cap portion and the second ILD portion.