Infinera Corporation
HETEROGENEOUS COMMON SUBSTRATE MULTI-CHIP PACKAGE INCLUDING PHOTONIC INTEGRATED CIRCUIT AND DIGITAL SIGNAL PROCESSOR

Abstract:

An optical transceiver package comprising a transceiver module, a digital signal processor (DSP), a substrate supporting the transceiver module and the DSP, and a barrier to mechanically protect and thermally insulate the transceiver module. The substrate comprises a material having a coefficient of thermal expansion (CTE) of 2.3-14 ppm/.degree. C. and the barrier comprises a material having a CTE of 3.5-14 ppm/.degree. C.