Intel Corporation
UNDERFILL MATERIAL FOR INTEGRATED CIRCUIT (IC) PACKAGE

Abstract:

Embodiments herein describe techniques for an IC package including an electronic component, and an underfill material around or below the electronic component to support the electronic component. The underfill material includes a resin and a thermolatent onium salt as a cationic cure for the underfill material. The thermolatent onium salt comprises an organic cation with a heteroatom center, and an anion including metalloid fluoride. The heteroatom center includes an iodonium, sulphonium, phosphonium, or N-containing onium. Other embodiments may be described and/or claimed.